Overview

GigaDevice SPI NOR Flash and SPI NAND Flash are available in 4Mbit~2Gb WLCSP (Wafer Level Chip Scale Packaging). Different from the traditional plastic package, WLCSP is a wafer-level chip package that has the same package dimension as the bare die. Our smallest WLCSP dimension can be less than 1mm in length, in width, and as thin as 0.25mm thickness, offer unparalleled size advantages for compact board designs. At the same time, WLCSP packaging can also enhance the heat dissipation of the chip and improve the stability of data transmission.

From small size to low power consumption, GigaDevice has broken through the physical limits of memory devices with WLCSP packaging, and now has been widely used in wearable applications.

With the development of miniaturization market demand, WLCSP will continue to become one of the important packaging forms now, and in the future.