Parallel NAND Flash
GigaDevice GD9F Parallel NAND Flash offers the high-density storage and performance necessary for multimedia data storage applications on mobile devices, set-top boxes, data cards, TVs, and more.
GigaDevice's Parallel NAND Flash complies with ONFI 1.0 protocol. The product provides 1Gb to 8Gb density options. It supports either 3V or 1.8V voltage, and x8 or x16 I/O interfaces, as well as mainstream packages such as TSOP48 and BGA63. GigaDevice Parallel NAND Flash is a showcase based on the company’s proven design philosophy and its commitment to independent design ability. The incorporation of innovative breakthroughs and rigorous quality control standards throughout the product’s design provides industrial, communication, and consumer electronic applications with a wide range of high-speed and high-reliability solutions.
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| Part No. | Status | Voltage | Density | I/O Bus | Pagesize | ECC Requirement | Sequential Access Time | Features | Packages | Temperature |
|---|---|---|---|---|---|---|---|---|---|---|
| GD9FU1G8F2D | MP | 3V | 1Gb | x8 | 2K+128B | 8bit-ECC | 12ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FU2GxF2A | MP | 3V | 2Gb | x8,x16 | 2K+128B | 4bit-ECC | 20ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FU2GxF3A | MP | 3V | 2Gb | x8,x16 | 2K+64B | 4bit-ECC | 20ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FU4GxF3A | MP | 3V | 4Gb | x8,x16 | 2K+64B | 4bit-ECC | 20ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FU8GxE3A | MP | 3V | 8Gb | x8,x16 | 2K+64B | 4bit-ECC | 20ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FS1G8F2D | MP | 1.8V | 1Gb | x8 | 2K+128B | 8bit-ECC | 20ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FS2GxF2A | MP | 1.8V | 2Gb | x8,x16 | 2K+128B | 4bit-ECC | 25ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FS2GxF3A | MP | 1.8V | 2Gb | x8,x16 | 2K+64B | 4bit-ECC | 25ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FS4GxF3A | MP | 1.8V | 4Gb | x8,x16 | 2K+64B | 4bit-ECC | 25ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FS8GxE3A | MP | 1.8V | 8Gb | x8,x16 | 2K+64B | 4bit-ECC | 25ns | N/A |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AU2GxF3A | MP | 3V | 2Gb | x8,x16 | 2K+64B | ECC-free | 20ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AS2GxF3A | MP | 1.8V | 2Gb | x8,x16 | 2K+64B | ECC-free | 25ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AU4GxF3A | MP | 3V | 4Gb | x8,x16 | 2K+64B | ECC-free | 20ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AS4GxF3A | MP | 1.8V | 4Gb | x8,x16 | 2K+64B | ECC-free | 25ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AU8GxE3A | MP | 3V | 8Gb | x8,x16 | 2K+64B | ECC-free | 20ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9AS8GxE3A | MP | 1.8V | 8Gb | x8,x16 | 2K+64B | ECC-free | 25ns | Internal ECC |
TSOP48 20*12mm, BGA63 9*11mm |
-40℃~85℃, -40℃~105℃ |
| GD9FU4G8F4D | MP | 3V | 4Gb | x8 | 4K+256 | 8bit-ECC | 12ns | N/A |
TSOP48 20*12mm BGA63 9*11mm |
-40℃~85℃ -40℃~105℃ |
| GD9FS4G8F4D | MP | 1.8V | 4Gb | x8 | 4K+256 | 8bit-ECC | 20ns | N/A |
TSOP48 20*12mm BGA63 9*11mm |
-40℃~85℃ -40℃~105℃ |
| GD9FU8G8E4D | MP | 3V | 8Gb | x8 | 4K+256 | 8bit-ECC | 12ns | N/A |
TSOP48 20*12mm BGA63 9*11mm |
-40℃~85℃ -40℃~105℃ |
| GD9FS8G8E4D | MP | 1.8V | 8Gb | x8 | 4K+256 | 8bit-ECC | 20ns | N/A |
TSOP48 20*12mm BGA63 9*11mm |
-40℃~85℃ -40℃~105℃ |
