GigaDevice Parallel NAND Flash products comply with the ONFI 1.0 protocol.
These products cover four density ranges from 1Gb to 8Gb, operate on 3V or 1.8V power supplies, and offer Octal or x16 I/O interfaces. They are available in mainstream TSOP48 and BGA63 packages. Leveraging GigaDevice's innovation, proven design philosophy, independent R&D, and rigorous quality control, the Parallel NAND Flash series delivers high-speed performance, reliability, and versatile storage solutions tailored for industrial, communications, and consumer electronics applications.
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20 Results
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Voltage
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1.8V
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1Gb
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2Gb
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4Gb
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8Gb
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Part No
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Status
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Voltage
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Density
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Temperature (Industrial)
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I/O Bus
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Pagesize
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ECC Requirement
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Sequential Access Time
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Features
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Packages
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| MP | 3V | 1Gb | -40℃~85℃, -40℃~105℃ | x8 | 2K+128B | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+128B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 1Gb | -40℃~85℃, -40℃~105℃ | x8 | 2K+128B | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+128B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | 4bit-ECC | 25ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 20ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃, -40℃~105℃ | x8, x16 | 2K+64B | ECC-free | 25ns | Internal ECC | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 4Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 4Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 3V | 8Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 12ns | N/A | TSOP48 20*12mm, BGA63 9*11mm | |
| MP | 1.8V | 8Gb | -40℃~85℃,-40℃~105℃ | x8 | 4K+256 | 8bit-ECC | 20ns | N/A | TSOP48 20*12mm, BGA63 9*11mm |
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