The GD25/55X and GD25/55LX Octal SPI NOR Flash series deliver ultra-high performance, supporting up to 200MHz operating frequency and an industry-leading 400MB/s data throughput, which is over five times faster than traditional solutions.
These Octal NOR Flash memory products are ideal for high-performance applications that require fast data access, such as code execution from flash, firmware updates, and real-time data storage.
With features like instant-on capability and Execute-in-Place (XIP) support, these devices enable direct code execution on flash, minimizing the need for RAM and thus reducing system cost and board space.
Built-in ECC algorithms and CRC check functions enhance data integrity and extend product lifespan. Additional features like DQS (Data Strobe) and DLP (Data Learning Pattern) ensure data reliability in high-speed system designs.
The GD25/55X and GD25/55LX series are well-suited for advanced applications such as Artificial Intelligence (AI), Machine Learning (ML), 5G base stations, automotive systems, and industrial automation.
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12 Results
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Voltage
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3V
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1.8V
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1.8V VCC, 1.2V VIO
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Density
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64Mb
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128Mb
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256Mb
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512Mb
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1Gb
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2Gb
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Part No
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Status
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Voltage
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Density
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Temperature (Industrial)
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Frequency (MHz)
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Features
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Packages
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| MP | 3V | 2Gb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) | |
| MP | 1.8V | 2Gb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) | |
| MP | 3V | 1Gb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) | |
| MP | 1.8V | 1Gb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) | |
| MP | 3V | 512Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) | |
| MP | 1.8V | 512Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 166(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP, RWW | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array) | |
| MP | 1.8V | 512Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) | |
| MP | 1.8V | 256Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | SOP16 300mil, TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) | |
| MP | 1.8V | 128Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) | |
| UD | 1.8V VCC, 1.2V VIO | 128Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) | |
| MP | 1.8V | 64Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array) | |
| UD | 1.8V VCC, 1.2V VIO | 64Mb | -40℃~85℃, -40℃~105℃, -40℃~125℃ | 200(x1 x8), 200(x8 DTR) | ECC, DTR, H/W RESET, WP#, Secured OTP | TFBGA24 8x6mm (5x5 ball array), WLCSP (4x6 ball array) |
Status Legend: MP=Mass Production, UD=Under Development, S=Sample, NR=Not Recommend
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