SPI NAND Flash
In 2013, GigaDevice launched the industry's first low-pin-count 8-pin SPI NAND Flash. After years of continuous development, the product line now offers full coverage across consumer electronics, industrial, networking, and automotive applications.
SPI NAND Flash features on-chip ECC and supports the QSPI interface, delivering high speed, high reliability, and low power consumption.
Compared to traditional parallel NAND Flash, SPI NAND Flash offers significant advantages, including an 8-pin compact package that shares the same PCB layout as SPI NOR Flash. Its compatibility in hardware design and firmware algorithms with Quad SPI also enables easier system integration.
Since its introduction, SPI NAND Flash has been widely adopted by designers as a key solution for embedded application code and data storage.
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1.8V
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3V
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1Gb
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2Gb
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8Gb
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ECC Requirement
PackagesMP 3V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) S 3V 1Gb -40℃~85℃, -40℃~105℃ 166(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 3V 2Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 2Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 3V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 3V 4Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 3V 4Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 3V 8Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 1Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 1Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) S 1.8V 1Gb -40℃~85℃, -40℃~105℃ 133(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 2Gb -40℃~85℃, -40℃~105℃ 80(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 2Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) MP 1.8V 4Gb -40℃~85℃, -40℃~105℃ 80(x1 x2 x4) 2KB ECC-free WSON8 8x6mm MP 1.8V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 2KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 1.8V 4Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, WSON8 6x5mm, TFBGA24 8x6mm (5x5 ball array) UD 1.8V 8Gb -40℃~85℃, -40℃~105℃ 104(x1 x2 x4) 4KB ECC-free WSON8 8x6mm, TFBGA24 8x6mm (5x5 ball array) -
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